Disassembled Parts

During the course of repair activities initiated to address visibility issues affecting both display modules, the unit was disassembled for inspection. Upon opening, it was discovered that the main board exhibited significant moisture content, with condensation and residue covering multiple components.

This condition indicates environmental ingress or inadequate sealing, leading to high humidity exposure within the enclosure. The presence of moisture across active circuitry poses risks of corrosion, short-circuiting, and progressive degradation of electronic components.

Immediate corrective action requires:

• Drying and decontamination of the affected board surfaces.
• Inspection for corrosion or oxidation on component leads and solder joints.
• Verification of insulation resistance to ensure no leakage paths remain.
• Implementation of protective measures such as conformal coating or improved enclosure sealing to prevent recurrence.